Fused silica wafer with thickness of 350 um with high-quality glass vias of diameters between 0.25 mm and 6 mm fabricated by selective laser etching. From 10.1117/1.OE.60.2.025105 Disclaimer: AAAS and ...
Ultrafast lasers have introduced new possibilities in engraving ultrafine structures, and scientists are now also investigating how to use them to etch microstructures into thin glass. There are ...
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