ISMANING, Germany--(BUSINESS WIRE)--Kontron, a leading global provider of IoT/Embedded Computer Technology (ECT), announces the development of a COM-HPC Mini module based on the COM-HPC 1.2 ...

The PICMG consortium has ratified the COM-HPC specification for high-performance computing modules. It defines five module sizes to deliver edge server performance for small, rugged data centres and ...

PICMG’s COM-HPC committee has finalized the pinout and dimension definitions for the COM-HPC Mini form factor, announced in June 2022. The consortium for the development of open embedded computing ...

Doug Sandy is the CTO of PICMG, an industry consortium focused on developing open and modular computing specifications. He, along with dozens of member companies who participated in the development of ...

New COM specification will meet the increasing server-level requirements of high-end edge-computing applications. Things are really starting to heat up with regard to the amount of computing power ...

The COM-HPC® Revision 1.3 specification from PICMG updates the Computer-on-Module standard with support for PCI Express Gen 6 and Compute Express Link (CXL), enabling higher data throughput and ...

What’s in the COM-HPC standard? How to get started with COM-HPC. The COM-HPC standard has now been ratified. And on that front, congatec highlighted its HPC/cTLU COM-HPC client at Embedded World ...

The COM-HPC Mini modules in Congatec's conga-HPC/mIQ-X series are based on Qualcomm's Dragonwing IQ-X series processors. © Congatec Embedded module supplier Congatec ...

congatec has launched a fully specification compliant ecosystem for engineers of COM-HPC Client and Server module based designs, following the publication of the COM-HPC Carrier Board Design Guide by ...

ADLINK Technology has launched the COM-HPC-mMTL – an embedded module that is the only small form factor solution that's available with Intel Core Ultra architecture and rich I/O capabilities.