Alpha and Omega Semiconductor Limited released a family of low on-resistance 8V, 20V, and 30V MOSFETs in the ultra-thin molded chip scale package (MCSP). The MCSP devices feature a maximum height of ...

Chip-scale laser controls trapped ions for quantum clocks and qubits, enabling portable, scalable systems with high fidelity ...

Achieving the circuit densities we need for the next generation of electronics demands advanced packaging and chip-scale interconnect solutions. The need to look for alternative packaging solutions to ...

For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...

Microchip has developed a single-I/O bus UNI/O EEPROM devices in miniature, wafer-level chip-scale and TO-92 packages, in addition to the 3-pin SOT-23 package. Measuring 0.85 mm x 1.38 mm, the ...

Professor Daniel Blumenthal's lab develops chip-scale components that can bring the power and precision of quantum science outside of the tightly controlled environment of the lab. (Santa Barbara, ...

Researchers at the National Institute of Standards and Technology (NIST) have developed a new way to package photonic ...

Leveraging Menlo’s Ideal Switch technology, the MM5230 RF switch minimizes insertion loss and provides high power handling in a chip-scale package. The device is a SP4T switch that operates from DC to ...

MEMS are primarily transducer systems that can control or sense chemical, optical, or physical quantities, such as fluids, acceleration, or radiation. A MEMS device/transducer possesses an electrical ...